|
脚位/封装
|
FBGA
|
|
外包装
|
TRAY
|
|
无铅/环保
|
无铅/环保
|
|
电压(伏)
|
1.35v
|
|
温度规格
|
0°C~+85°C
|
|
速度
|
1600 MHZ
|
|
标准包装数量
|
1600
|
|
标准外箱
|
|
|
潜在应用
|
-
PC BOARD MANU./PCB板製造商
-
R&D DESIGN HOUSE/研發/設計
|
|
Number Of Words
|
256M
|
|
Bit Organization
|
x16
|
|
Density
|
4G
|
|
Package Material
|
lead & halogen free(ROHS compliant)
|
|
Hynix Memory
|
H
|
|
No Of Banks
|
8 banks
|
|
Die Generation
|
4th
|
|
Product Family
|
DRAM
|
|
Shipping Method
|
tray
|
|
Operating Temperature
|
commercial temperature(0°C~85°C) & 1.35 VDD power
|