型号：4406
厂商：Adafruit Industries LLC
大小：529.41 Kbytes
页数：共2页
功能：SOLDER WIRE HOLDER STAND TJ-227
厂商：Eaton - Electronics Division
功能：FUSE BLOCK CART 250V 30A CHASSIS
厂商：Pololu Corporation
功能：QTRX-HD-06A REF ARRAY 6CHNL
大小：12.62 Mbytes
页数：共56页
厂商：Marathon Motors
大小：401.94 Kbytes
页数：共4页
功能：AC Motor, Pump Duty, 1/3,1725,DP,48Y,1/60/115
型号：44060
厂商：ETC1[List of Unclassifed Manufacturers]
大小：104.01 Kbytes
页数：共1页
功能：PRIMARY VOLTAGE, Vacuum filling, Two compartments bobbins
型号：4406-10SR
厂商：MULTICOMP PRO
大小：204.12 Kbytes
功能：IDC连接器, 带接线片, IDC插头, 公, 2.54 mm, 2排, 10 触点, 电缆安装
型号：44061-3P
厂商：TE Connectivity / DEUTSCH
大小：120.90 Kbytes
功能：矩形军用规格连接器 HERM RECP
型号：4406-20SR
大小：204.19 Kbytes
功能：IDC连接器, 带接线片, IDC插头, 公, 2.54 mm, 2排, 20 触点, 电缆安装
型号：440670201
厂商：MOLEX
大小：31.49 Kbytes
功能：Conn Wire to Board HDR 2 POS 3mm Solder ST Thru-Hole Micro-Fit 3.0? Tray
型号：44067-0201
厂商：MOLEX6[Molex Electronics Ltd.]
大小：216.01 Kbytes
页数：共3页
功能：3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
型号：44067-0401
大小：216.02 Kbytes
功能：3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
型号：440670402
大小：31.52 Kbytes
功能：Conn Wire to Board HDR 4 POS 3mm Solder ST Thru-Hole Micro-Fit 3.0? Tray
型号：44067-0402
大小：216.08 Kbytes
型号：44067-0403
功能：3.00mm (.118") Pitch Micro-Fit 3.0⢠Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating
型号：44067-0601
功能：3.00mm (.118") Pitch Micro-Fit 3.0⢠Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 6 Circuits, Tin (Sn) Plating
型号：44067-0602
功能：3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm
型号：44067-0603
型号：44067-0801
型号：44067-0802
功能：3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick
型号：44067-1001
型号：44067-1002
型号：44067-1003
型号：44067-1201
大小：216.03 Kbytes
功能：3.00mm (.118") Pitch Micro-Fit 3.0⢠Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, Tin (Sn) Plating
型号：44067-1202
型号：44067-1203
功能：3.00mm (.118") Pitch Micro-Fit 3.0⢠Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating
型号：44067-1401
型号：44067-1402
功能：3.00mm (.118") Pitch Micro-Fit 3.0⢠Wire-to-Board Header
型号：44067-1403
功能：3.00mm (.118") Pitch Micro-Fit 3.0⢠Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 14 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating
型号：44067-1601
