型号：53012
厂商：MICROPAC[Micropac Industries]
大小：149.02 Kbytes
页数：共4页
功能：SPST SOLID-STATE RELAY
型号：53012_02
大小：76.16 Kbytes
型号：530122B00162G
厂商：Aavid
大小：242.62 Kbytes
页数：共2页
功能：散热片 High-Rise Style Board Level Stamped Heatsink for TO-220, Vertical Mounting, Black Anodized, 12.45x44.45x44.45mm
厂商：Aavid, Thermal Division of Boyd Corporation
大小：237.40 Kbytes
功能：BOARD LEVEL HEAT SINK
