型号：CGB4
厂商：TDK[TDK Electronics]
大小：1222.08 Kbytes
页数：共8页
功能：MULTILAYER CERAMIC CHIP CAPACITORS
型号：CGB4911
厂商：BUSSMANN
大小：398.40 Kbytes
页数：共6页
功能：Cable Accessories Gland Nut and Bushing Steel
型号：CGB4913
型号：CGB499
型号：CGB4B1JB1E225K055AC
厂商：TDK
大小：293.72 Kbytes
页数：共9页
功能：多层陶瓷电容器MLCC - SMD/SMT CGB 0805 25V 2.2uF JB 10% T: 0.55mm
型号：CGB4B1JB1E225M055AC
功能：多层陶瓷电容器MLCC - SMD/SMT CGB 0805 25V 2.2uF JB 20% T: 0.55mm
型号：CGB4B1X5R1E225K055AC
功能：多层陶瓷电容器MLCC - SMD/SMT CGB 0805 25V 2.2uF X5R 10% T: 0.55mm
型号：CGB4B1X5R1E225M055AC
功能：多层陶瓷电容器MLCC - SMD/SMT CGB 0805 25V 2.2uF X5R 20% T: 0.55mm
型号：CGB4B1X6S1C225K055AC
大小：138.74 Kbytes
页数：共1页
功能：Multilayer Ceramic Chip Capacitors
型号：CGB4B1X6S1C225M055AC
型号：CGB4B1X7R1A225K055AC
功能：多层陶瓷电容器MLCC - SMD/SMT CGB 0805 10V 2.2uF X7R 10% T: 0.55mm
型号：CGB4B1X7R1A225M055AC
功能：多层陶瓷电容器MLCC - SMD/SMT CGB 0805 10V 2.2uF X7R 20% T: 0.55mm
型号：CGB4B3JB1A225K055AB
功能：多层陶瓷电容器MLCC - SMD/SMT CGB 0805 10V 2.2uF JB 10% T: 0.55mm
型号：CGB4B3JB1A225M055AB
功能：多层陶瓷电容器MLCC - SMD/SMT CGB 0805 10V 2.2uF JB 20% T: 0.55mm
型号：CGB4B3JB1C225K055AB
大小：138.6 Kbytes
型号：CGB4B3JB1C225M055AB
型号：CGB4B3JB1E105K055AB
大小：138.49 Kbytes
型号：CGB4B3JB1E105M055AB
大小：138.51 Kbytes
型号：CGB4B3X5R1A225K055AB
型号：CGB4B3X5R1A225M055AB
大小：138.75 Kbytes
型号：CGB4B3X5R1C225K055AB
大小：138.72 Kbytes
型号：CGB4B3X5R1C225M055AB
大小：138.73 Kbytes
型号：CGB4B3X5R1E105K055AB
大小：138.62 Kbytes
型号：CGB4B3X5R1E105M055AB
大小：138.63 Kbytes
型号：CGB4B3X6S0J225K055AB
大小：138.65 Kbytes
型号：CGB4B3X6S0J225M055AB
型号：CGB4B3X6S1A225K055AB
大小：138.77 Kbytes
型号：CGB4B3X6S1A225M055AB
型号：CGB4B3X7R0J225K055AB
大小：138.69 Kbytes
型号：CGB4B3X7R0J225M055AB
大小：138.68 Kbytes
