型号:  1-1542001-9

功能描述:   Heat Sink Passive BGA Pin Array Clip Cold-Forged Aluminum Black Anodized

制造商:  te connectivity / amp

Rohs：  Lead free / RoHS Compliant

RoHS信息：  1-1542001-9 Statement of Compliance

标准包装：  250

类型：  Passive

冷却装置：  BGA

固定方法：  Clip

产品高度：  27.94 mm

散热片样式：  Pin Array

表面处理：  Black Anodized

材质：  Cold-Forged Aluminum

标准包装：  Trays

RoHS：  RoHS Compliant

评论：  Mounting clip does not increase overall heat sink height.

RoHSELV合规性：  RoHS compliant, ELV compliant

Lead Free Solder Processes：  Not relevant for lead free process

高（毫米（ ） ）：  27.94 [1.100]

直径（毫米）：  50.80 [2.000]

设备类型：  BGA

可燃性等级：  UL 94V-0

风扇类型：  No Fan

散热器类型：  Pin Fin 3

适用于：  BGA Semiconductor Packages

行：  ChipCoolers

产品类型：  Heat Sink

RoHSELV符合记录：  Always was RoHS compliant

包装尺寸（毫米）：  42.5 [1.675]

系列：  *

其他名称：  HTS268NF-U

RoHS指令：  Lead free / RoHS Compliant