型号:  7-1542002-8

功能描述:   Heat Sink Passive BGA Pin Array Clip Cold-Forged Aluminum Black Anodized

制造商:  te connectivity / amp

类型：  Passive

冷却装置：  BGA

固定方法：  Clip

产品高度：  12.7 mm

散热片样式：  Pin Array

表面处理：  Black Anodized

材质：  Cold-Forged Aluminum

标准包装：  Bulk

评论：  Mounting clip does not increase overall heat sink height.; Heat sink assembly i

RoHSELV合规性：  RoHS compliant, ELV compliant

Lead Free Solder Processes：  Not relevant for lead free process

高（毫米（ ） ）：  12.70 [0.500]

直径（毫米）：  34.95 [1.376]

设备类型：  BGA

可燃性等级：  UL 94V-0

风扇类型：  Ball/Sleeve Bearing

散热器类型：  Pin Fin 1

适用于：  BGA Semiconductor Packages

行：  ChipCoolers

产品类型：  Heat Sink

RoHSELV符合记录：  Converted to comply with RoHS directive

包装尺寸（毫米）：  27 [1.064]