型号:  C1805P103K1XRH7189

功能描述:  SMD Mil PRF55681, Ceramic, Military/High Reliability, 0.01 uF, 10%, 100 VDC, BX, R (0.01%/1000 Hrs), 1805

制造商:  KEMET Electronics

应用：  通用

安装类型：  表面贴装，MLCC

尺寸：  0.180" 长 x 0.050" 宽（4.57mm x 1.27mm）

厚度（最大值）：  0.055"（1.40mm）

底座宽度：  0.51mm +0.63/-0.25mm (0.02 in +0.025/-0.01 in)

故障率：  R (0.01%/1000 Hrs)

宽度：  4.57mm +1.02/-0.38mm (0.18 in +0.04/-0.015 in)

其他：  Termination Description: SolderCoat 60-40

包装：  T&R, 178mm, Plastic Tape

Qualifications：  MIL-PRF-55681

RoHS：  No

系列：  SMD Mil PRF55681

T：  0.98mm +0.8/-0.42mm (0.039 in +0.031/-0.017 in)

工作温度：  -55°C ~ 125°C

Termination：  Lead (SnPb)

Testing and Reliability：  MIL-PRF-55681

引脚宽度：  1.27mm +0.76/-0.38mm (0.05 in +0.03/-0.015 in)

电压：  100V

偏差：  ±10%

容值：  10nF

封装/外壳：  1805

温度系数：  BX

无铅情况/RoHs：  无铅/符合RoHs