型号:  SIGC08T60SE

功能描述:  

制造商:  Infineon Technologies

封装/外壳：  --

Packing Type：  WAFER SAWN

VDS max：  600.0V

Technology：  IGBT3 Fast

Operating Temperature min max：  -40.0 °C 150.0 °C

VGE(th) min max：  4.1 V 5.7 V

VCE(sat) max：  2.05 V

IC max：  15.0A

RoHS compliant：  yes

Packing Type：  WAFER SAWN

VDS max：  600.0V

Technology：  IGBT3 Fast

Operating Temperature min max：  -40.0 °C 150.0 °C

VCE max：  600.0 V

VDS max：  600.0 V

Operating Temperature min max：  -40.0°C 150.0°C

VGE(th) min max：  4.1 V 5.7 V

VCE(sat) max：  2.05 V

VCE max：  600.0V

VCE(sat) max：  2.05V

IC max：  15.0A

VGE(th) min max：  4.1V 5.7V

IC max：  15.0 A

无铅情况/RoHs：  无铅/符合RoHs